MARKET INSIGHTS The global Multi Chip Module Packaging Solution Market size was valued at US$ 2,930 million in 2024 and is projected to reach US$ 5,470 million by 2032, at a CAGR of 9.2% during the forecast period 2025-2032. Multi Chip Module (MCM) Packaging Solutions integrate multiple semiconductor dies within a single package, enabling enhanced performance while reducing footprint and power...